Integrated photonic systems are disrupting existing and future markets including optical communications sensing quantum computing autonomous driving AI AR/VR medical and many others. The complexity of photonic packaging is increasing and assembly & packaging testing and qualification are challenging. The newly established Swiss Photonics Integration Center (Swiss PIC) addresses these needs by providing precision assembly and packaging solutions for Swiss industry especially startups and SMEs. We will provide photonic packaging services for volumes from single prototypes to pilot series. The center which is located in the Switzerland Innovation Park InnovAARE next to the Paul Scherrer Institute is investing in qualified industrialized processes clean room facilities hightech machinery and will over time build up a full production line for optical precision assembly.

Tasks

The Opportunity: We are seeking a talented Electrical Engineer to join our team focusing on the design of electrical interfaces for photonic chips operating at high frequencies. Together with our customers you will choose the designs of the interfaces for current packaging projects as well as develop guidelines for future improvements of designs. As an important player in the photonics packaging community we will also help develop the standards for layouts and interfaces for the future photonics integrated circuit industry. This role offers a unique opportunity to work at the intersection of photonics and electronics shaping the future of technologies within communication computing and quantum and beyond.

Your tasks:

Develop stateofart packaging technologies for photonic integrated circuits (PICs).
Design and optimize electrical interfaces for photonic chips operating at high frequencies ensuring efficient signal transmission and low power consumption.
Conduct simulations and modeling to predict and analyze the performance of electrical interfaces identifying potential challenges and proposing innovative solutions.
Prototype test and iterate on interface designs leveraging stateoftheart tools and methodologies to achieve optimal performance and reliability.
Characterize and qualify the developed packaging solutions and document the results for customers.
Work with customers to define their photonics integration process.
Stay current with industry trends and emerging technologies in photonicelectronic integration contributing insights and expertise to drive innovation within the team.

Requirements

Your skills and expertise:

Masters or PhD in Electrical Engineering or a related field with a focus on highfrequency electronics or photonics industrial experience is a plus.
Strong background in analog and RF circuit design with experience in designing interfaces for highspeed data transmission or modulation.
Proficiency in simulation tools such as ADS CST or HFSS with the ability to analyze and optimize electrical performance at the chip level.
Familiarity with photonic devices and systems including an understanding of optical communication principles and components.
Experience with PCB design and layout considerations for highfrequency applications is a plus.
Excellent problemsolving skills and a collaborative mindset with the ability to work effectively in a dynamic interdisciplinary environment.
Solid written communication presentation and documenting skills.
A drive to be an important actor in the growth of the Swiss and EU PIC ecosystem

Benefits

We offer:

Opportunity to work on groundbreaking technology at the forefront of the industry shaping the future of communication and computing.
International Collaborative and inclusive team culture that values creativity diversity and continuous learning.
Personal responsibility in your job and the chance to grow with us.
Our passion to bring PICs to every days life.

Activity rate: 80100% Place of work: Villigen (CH) Start date: approx. September 2024

How to apply: We look forward to receiving your full application including 1) your CV 2) a statement of interest relating the position to your skills and 3) grades or work certificates. Applications will be considered as they come in with an expected deadline of June 15th.

RF Packaging Engineer at Swiss PIC