Principal Wireless SoC Architect (low power)

Shape the architecture of next-generation ultra-low-power wireless SoCs Join a world-class R&D environment where you'll influence strategic technology About Our Client:

Our client is an innovative international semiconductor company developing ultra-low-power integrated circuits and wireless SoC solutions for IoT, medical, industrial, automotive and consumer applications based in Neuchatel. Job Description:

Your Responsibilities as a Principal Wireless SoC Architect (low power)

• Define the end-to-end architecture of next-generation ultra-low-power wireless SoCs
• Drive system-level architecture and hardware/software partitioning
• Lead technical alignment across RF, Analog, Digital, Firmware, Packaging and Validation teams
• Optimise system performance, power consumption, cost and reliability
• Oversee SoC integration, including package and PCB considerations
• Contribute to the product roadmap and long-term technology strategy
• Support the full development lifecycle, from system requirements through validation and production qualification
• Act as the technical authority for architectural decisions across international engineering teams

The Successful Applicant:

Your ideal Profile as a Principal Wireless SoC Architect (low power)

• Degree in Electrical Engineering, Microelectronics or Computer Engineering
• Minimum 15 years of experience in Wireless SoC and RF CMOS architecture or design
• Proven track record of bringing low-power RF SoCs from concept to high-volume production
• Strong expertise in: RF CMO, Wireless System Architecture, SoC Integration, Mixed-Signal Design, Power Management, System Partitioning
• Deep understanding of Power, Performance and Area for low-power semiconductor design
• Experience with wireless communication protocols such as Bluetooth Low Energy (BLE), IEEE 802.15.4 , or equivalent technologies
• Exposure to advanced semiconductor process nodes (22nm and below) is an advantage

What's on Offer:

What You'll Find

• A highly innovative international semiconductor environment
• The opportunity to shape next-generation wireless SoC platforms
• Collaboration with multidisciplinary R&D teams across the globe
• A strategic technical leadership position with high impact on future products
• Position based in Switzerland (on-site role in Neuchatel)